![]() Metrically, we’re talking 2.54 mm and 7.62 mm respectively. ![]() The popular 14 and 20-pin DIP (dual in-line package) used a tenth of an inch between pins down the sides with three tenths across the package. The leads were formed so that they could be inserted into holes that were a half of an inch apart. Those Days Are GoneĪ resistor was big enough to have four or five bands of color so that we could determine the value and tolerance at a glance. Up to that point, we measured the pin to pin pitch in fractions of an inch. DIP packages were slowly being replaced by SOIC equivalents. Surface mount resistors and capacitors were just becoming a thing. Image Credit: Author - FPGAs drive circuit density with flexible architecture.ĭoing more with less has been a central theme ever since I moved from the assembly line to the CAD cave. We’ve come a long way towards shrinking the products and that comes with the cost of shrinking the components. Through-hole components were a breeze to install and rework if necessary. ![]() Things have improved for the environment but I’m not so sure I can say that about the workers. It was hazardous to the environment and the assemblers. Did I ever mention that I worked on an assembly line? Yup, way back when we used lead in our solder and freon to clean the flux off of the boards.
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